The Cochlear™ Baha® 3 System

Cochlear Implants
Cochlear™, the global leader in implantable hearing solutions, has made the best even better with the Cochlear Baha® 3 System, featuring the Cochlear Baha 3 Sound Processors and the Cochlear Baha BI300 Implant System. The Baha 3 sets a new benchmark in design and flexibility for every age and lifestyle. Baha 3 is backed by the lifelong promise that Cochlear will be there to support you with the industry’s most comprehensive customer support and the largest investment in research and development.

Cochlear Baha 3 BI300 Implant

Improved stability

  • Wider diameter
  • Small sized threads below flange
  • TiOblast™ surface (promotes integration with bone)
  • New conical shape

Trusted solution

  • Market leader and innovator
  • Tri-lobe connection
  • Helium-tight seal
  • Precise countersinking

Simplified surgery

  • Single-use instrument kit
  • Improved packaging
  • Fewer tools and steps

Cochlear Baha 3 Sound Processors

Enhanced features

  • Programmable, advanced signal processing
  • Water protection
  • Easier to use tactile buttons
  • Wind noise protection

Proven performance

  • Baha 3 performs up to 25% better than Divino® in noise 1,2
  • Better performance on Softbands
  • More high frequency gain realized

Kid-friendly solutions

  • Better access to speech
  • New battery door colors
  • New Softband options

Cochlear Baha 3 Professional Tools

  • Precise fitting
  • Refined Cochlear Baha Prescription formula
  • Software that is Microsoft® Windows® 7 compatible



1. Davison T, Leese D, Marley S, Johnson IJ. Clinical impressions of a new Bone Anchored Hearing Aid processor. In: 2nd International symposium on bone conduction hearing - craniofacial osseointegration; 2009 11-13 June 2009; Göteborg, Sweden; 2009.
2. Percentage estimated using data from: Wilson et al., “An Evaluation of BKB-SIN, HINT, Quick SIN, and WIN Materials on Listeners with Normal Hearing and Listeners with Hearing Loss” JSLHR, Vol. 50, Aug 2007; 844-856.
Document last modified: Tuesday, August 9, 2011